Simulation and Reliability Assessment of Advanced Packaging
Kuo-Ning Chiang$82.32
$96.85
Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved in thermal/mechanical modeling, package design, material selection, qualification, and reliability assessment of advanced packaging will benefit from this reprint.
Binding Type: Hardcover
Publisher: Mdpi AG
Published: 04/30/2024
ISBN: 9783725809721
Pages: 296
Weight: 1.84lbs
Size: 9.61h x 6.69w x 0.94d