{"product_id":"simulation-and-reliability-assessment-of-advanced-packaging-9783725809721","title":"Simulation and Reliability Assessment of Advanced Packaging","description":"\u003cp\u003eTopics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved in thermal\/mechanical modeling, package design, material selection, qualification, and reliability assessment of advanced packaging will benefit from this reprint.\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eBinding Type:\u003c\/b\u003e Hardcover\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e Mdpi AG\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 04\/30\/2024\u003cbr\u003e\u003cb\u003eISBN:\u003c\/b\u003e 9783725809721\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 296\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 1.84lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.61h x 6.69w x 0.94d","brand":"Kuo-Ning Chiang","offers":[{"title":"Default Title","offer_id":44723195084981,"sku":"9783725809721","price":82.32,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0473\/0804\/6492\/files\/img_b4e109da-3798-4e94-8176-e9a2de7079b5.jpg?v=1729007001","url":"https:\/\/pastforward.org\/products\/simulation-and-reliability-assessment-of-advanced-packaging-9783725809721","provider":"Past Forward","version":"1.0","type":"link"}